



Semiconductor fabs and foundries play a vital role in the semiconductor industry. Over the years, there have been sizeable investments in the building of these complex front-end fabs. Also, there have been fabs that have invested in converting the fabs to accommodate larger wafer sizes changes as well as changes in technology nodes. Just recently, there have been announcements of fabs merging or closing.
As more of these wafer fabs are built (or converted), information is needed to analyze the investment requirements, construction spending, equipment spending, first silicon, volume production, and upgrades/expansion.
|
|
The SEMI databases deliver the latest fab trends and a complete analysis on semiconductor fabs and foundries worldwide and are ideal resources to empower your market research. Identify target customers and analyze both investment and technology trends with a comprehensive and dynamic range of information designed to help meet your market research needs faster and easier than ever.
The database includes front-end fabs and foundries such as TSMC, UMC, Chartered Semiconductor, SMIC, Samsung, Intel, GlobalFoundries (AMD), Toshiba, Micron Hynix, Powerchip, Texas Instruments, Renesas, Inotera, Elpida, STMicro, Fujitsu, Hitachi, NEC Electronics, Dongbu Hi Tek, ProMOS, Nanya, Matsushita, NXP, Winbond, IBM Micro, Mikron (Sitronics), Sharp, Freescale, Grace Semiconductor, Infineon, Spansion, Magna Chip, X-Fab, LETI, Vanguard, and more…..


Spending on fab construction projects in 2009 is expected to be under $2 billion – the lowest level since 1999.















